ADVANCED PCB LAMINATES

NAME Tg ºC
(TMA)
Dielectric Constant (DK)
@10GHz
DISSIPATION FACTOR (DF)
@10GHz
Time to Delam Solder Float @ 288C
(based on bare clads)
Water Absorption
Low Performance
FR4: Xbrand 140 140 4.55 0.0200 >180 seconds 0.300 %
High Performance
**FR4: TUC TU-863
Halogen Free
180 3.90 0.009 >60 seconds No Data %
**FR4: Nanya 175FM 170 3.80 0.0100 >600 seconds 0.200 %
FR4: Isola 408HR 200 3.68 0.0100 “pass”, no time indicated 0.060 %
FR4: Panasonic Megtron6 185 3.61 0.0040 >120 seconds 0.150 %
FR4: TUC TU-872SLK sp 200 3.50 0.0080 >60 seconds 0.130 %
Ultra Performance
Polyimide: Arlon 85N 260 4.2 @ 1MHz .01 @ 1MHz >360 seconds 0.270 %
Ceram/Epoxy: Rogers 4350 280 3.48 0.0040 >390 seconds 0.060 %

PROVEN DIRECT MATERIAL SUPPLIERS

Materials Description Supplier Series Spec UL Listed RoHS Compliant
Copper Clad Laminate TUC, Panasonic, Rogers, Arlon GI,TUC TU-863 (halogen free), Meg6 R4350, 84N TU-863/872 SLK High Tg>170 Yes Yes
Copper Foil Nikko Materials HTE 1/2 oz, 1 oz, 2 oz Yes Yes
Solder Mask Taiyo PSR-2000, 4000,.. LPI Green, Blue, Clear, Black Yes Yes
Legend Ink Taiyo S-200W White Yes Yes
Copper Plating Atotech Cupracid n/a n/a Yes
Nickel/Gold Plating Uyemura GoBright n/a n/a Yes