Stack-up, flatness, material

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Main DFM image
2.1
Copper foil outer see guideline 1.3
2.2
Board thickness (min/max)
2.3
Thickness finished tolerance
2.4
How many layers fit in a stack thickness, see table below
2.5
Minimum dielectric thickness to prevent lam void
2.6
Warpage, per inch IPC TM 650 (general requirement)
2.7
Material see a table
2.8
HDI: Construction
2.9
Minimum dielectric thickness for 240VDC
2.1 2.2 2.3 2.4 2.5 2.5 2.5 2.5 2.6 2.6 2.6 2.7 2.8 2.9